Printed Circuit Design White Papers

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Printed Circuit Design White Papers (View All Report Types)

Design-for-Test Analysis of a Buffered SDRAM DIMM sponsored by Texas Instruments, Inc. WHITE PAPER: This document presents a design-for-test analysis of a buffered synchronous dynamic random access memory dual in-line memory module. Posted: 11 Mar 2002 \| Published: 13 Aug 1996 TOPICS: Circuit Design \| DRAM \| Integrated Circuit Test Equipment \| RAM \| Testing

IEEE 1149.1 Use in Design for Verification and Testability at Texas Instruments sponsored by Texas Instruments, Inc. WHITE PAPER: This document introduces those products that include ASIC cells, standard interface ICs, a bus master IC, a controller interface board for IBM compatibles, a high-speed scan interface, and software to control the scan bus. Posted: 17 Mar 2002 \| Published: 05 May 2000 TOPICS: ASIC \| Circuit Design \| Integrated Circuit Test Equipment \| Standards \| Testing

Built-in Self-test (BIST) Using Boundary Scan sponsored by Texas Instruments, Inc. WHITE PAPER: This document shows how existing architectures can be modified to conform to IEEE 1149.1 architecture. Posted: 09 May 2000 \| Published: 01 Dec 1996 TOPICS: Architectures \| Circuit Design \| Integrated Circuit Test Equipment \| Integrated Circuits \| Standards \| Testing

Unlock Endless Possibilities with Easy to Use AI Tools sponsored by Slack WHITE PAPER: Enable smarter and more secure collaboration with simple access to AI-powered time-savers. Posted: 20 Nov 2023 \| Published: 20 Nov 2023 TOPICS: IT Management

Automated HCI: An Ideal Match for Your Hybrid Cloud sponsored by Hitachi Vantara WHITE PAPER: Read this paper to learn how hyperconverged infrastructure (HCI) and VMware Cloud Foundation reduce the complexity of hybrid cloud. Posted: 23 Aug 2021 \| Published: 23 Aug 2021 TOPICS: IT Management

Extreme File System Performance on Supermicro Servers sponsored by Supermicro WHITE PAPER: Check out this white paper to learn about Supermicro's next-gen X12 BigTwin hardware, featuring 3rd Generation Xeon® Scalable Processors supporting up to 40 cores, higher instructions per clock, and two 512-bit-FMA units. Posted: 08 Sep 2021 \| Published: 08 Sep 2021 TOPICS: IT Management

11 Ways Infrastructure and Service Visibility Delivers Benefits Across IT sponsored by ServiceNow WHITE PAPER: This paper provides 11 examples of how ServiceNow®IT Operations Management (ITOM) Visibility and other ServiceNow applications provide a solid foundation by working together. Posted: 06 Oct 2021 \| Published: 06 Oct 2021 TOPICS: IT Management

Building Tomorrow's Enterprise sponsored by Hewlett Packard Enterprise WHITE PAPER: This paper focuses on the steps you need to take to navigate a cloud-everywhere transformation successfully and some of the best practices that will help you along the way. Posted: 17 Jun 2021 \| Published: 17 Jun 2021 TOPICS: IT Management

Protect and Preserve Your Data from Endpoint to Infrastructure sponsored by Dell Technologies, Intel and Vmware WHITE PAPER: Read this paper to learn how to achieve cyber resilience and learn how to protect your data from endpoint to infrastructure with help from a partnership between Dell Technologies and VMware. Posted: 11 Nov 2021 \| Published: 11 Nov 2021 TOPICS: IT Management

Market Guide for AIOps Platforms sponsored by ServiceNow WHITE PAPER: AIOps platforms are becoming more widespread; yet successfully deploying an one is easier said than done. The benefits of successful deployment, however, are plenty: leaders can comprehend and contextualize large amounts of unstructured and volatile data, augment ITOps, and perform better analysis. Read on to learn more about the state of AIOps. Posted: 29 Apr 2021 \| Published: 29 Apr 2021 TOPICS: IT Management